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Process Optimization of Electronics Encapsulation with Reactive Thermosets

Learn how a global automotive supplier achieved up to 8% cycle time reduction in a short cycle process


Across the globe, industries face increasing pressure to assess their contributions to the rapid advance of climate change. Businesses must acknowledge the carbon footprint of their operations and waste production and work with sustainable practices. However, these duties do not come without opportunity. Processors who invest in technology to make their manufacturing operations more sustainable will find themselves at a competitive advantage.

A global player in the automotive industry, producing critical electronics components used in electric drive systems, took action and looked for a solution to reduce cycle time and material waste in their new processing lines. By using state-of-the-art, in-mold technology that uses real-time material characterization and artificial intelligence (AI) data analytics, the company significantly reduced curing time. After carrying our early part analysis, which reduces material waste, the automotive supplier lowered their facility’s carbon footprint and improved sustainable practices.

Process optimization of electronics encapsulation in the automotive industry

On-demand webinar

What you will learn in this webinar:


  • Challenges when setting up new processing lines to encapsulate circuit boards with a new grade of reactive epoxy
  • Examining and evaluating cure behavior and the resulting cycle times in a series of encapsulation studies using the sensXPERT Digital Mold solution
  • Identifying key quality parameters and creating AI models for predicting these at demolding
  • Achieve up to an 8% cycle time reduction in a short cycle process
Watch Now

Our speaker

Dr. Nicholas Ecke

Dr. Nicholas Ecke has been a part of the NETZSCH Process Intelligence GmbH team alongside Dr. Alexander Chaloupka since October 2022. He studied process and medical engineering at the Technical University of Munich and was a chief engineer for the chair of composite materials at the Technical University of Kaiserslautern. In 2021, he completed his doctorate in engineering and his dissertation was awarded the Oechsler Prize. The thesis dealt with methods and approaches for developing and designing tribological components made of plastics. As a sensXPERT, Dr. Nicholas Ecke ensures the smooth integration of an intelligent sensor technology, namely the sensXPERT Digital Mold, in customers’ production processes worldwide.

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Process Optimization of Electronics Encapsulation with Reactive Thermosets