Boosting productivity, performance to address supply-chain shortages
Greater volumes of data are being pushed through wired and wireless devices at much higher speeds to support the Internet of Things (IoT), electric and autonomous vehicles, 5G cellular networks, smart cities, and video-streaming services. Continued component miniaturization (requiring thinner parts to provide comparable or higher thermo-mechanical performance), higher density and more complex interconnects (with reduced space to dissipate heat), orders-of-magnitude higher transmission (data-transfer) speeds (leading to concerns about signal loss, distortion, and cross-talk/interference), and concerns about data security are just a few challenges manufacturers face.
To address supply-chain disruptions and prevent data bottlenecks at the device level, performance upgrades are being made at both the device and board level, necessitating molders produce smaller, higher-performance components faster than before.
Our contributions for the electronics encapsulation industry
Manufacturing at the Speed of Data Transfer
sensXPERT Digital Mold empowers production engineers to exploit untapped cost-saving potentials. The state-of-the-art solution measures material behavior in real-time and during production. Combining our 50 years expertise in material science with real-time sensor data on material behavior, our solution predicts the perfect timing to demold the part. User-centric cloud software allows for easy management and governance of all data as a single source of truth. Transparent and personalized visualization of process parameter gives all interested parties insights into the KPIs that matter to them.sensXPERT Digital Mold
Key Benefits of our Solution
Increase reliability under more demanding operating conditions, debottleneck supply-chain
Better protect critical components against rising temperatures, expansion mismatches, higher transmission rates, and potential signal loss.
Offset Higher Material Costs
Increase predictability and productivity to help offset higher cost of using more demanding polymers.
Ensure Consistency no matter Location
Debottleneck supply, support global customers, ensure processes are controlled and consistent regardless of where production occurs, help bring products to market faster.
Designed to optimize your processes
Reaction Injection Molding
RIM produces high-density, high-modulus elastomeric parts or stiff, low-density parts with solid skins and foamed cores characterized by very low shrinkage and post-mold cracking with Class A painted surfaces. Either form may incorporate metallic inserts or be reinforced to provide semi-structural or structural performance. Liquid resin components—usually thermoset, although reactive PA6 also can be used—are premixed at high pressure (10-21 MPa), then injected into a closed/2-sided tool at much lower pressures (0.4-1.1 MPa; 100-150 tonnes clamping force) to produce highly-complex parts allowing significant variations in wall thickness. Since the mold is filled before polymerization begins, parts exhibit low internal stresses. Often used to produce very-large parts, RIM also is used for electronics encapsulation.
Transfer molding is a closed-mold process where a solid or liquid, rigid or elastomeric, thermoset or thermoplastic resin is preheated in a chamber (transfer pot) above a mold, then injected (via hydraulic plunger) under high pressure (up to 100 MPa) into the tool to be shaped and cured, resulting in 3D parts with excellent dimensional stability. The mold may be precoated with gelcoat and/or loaded with a fiber preform, yielding parts with up to 60% FVF. The process is also commonly used to encapsulate electronic components, which also can be preinserted into the tool. Although capital investment is lower than injection, scrap rates are higher, cycle times are much slower, and fewer cavities can be filled per injection, making it less productive for high-volume manufacturing. However, sharper angles can be molded without issue. Presses open on the vertical, not horizontal axis as in injection molding.